JPS6239563B2 - - Google Patents

Info

Publication number
JPS6239563B2
JPS6239563B2 JP518180A JP518180A JPS6239563B2 JP S6239563 B2 JPS6239563 B2 JP S6239563B2 JP 518180 A JP518180 A JP 518180A JP 518180 A JP518180 A JP 518180A JP S6239563 B2 JPS6239563 B2 JP S6239563B2
Authority
JP
Japan
Prior art keywords
planar circuit
mixer diode
diode
dielectric plate
mixer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP518180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56102102A (en
Inventor
Yasoo Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP518180A priority Critical patent/JPS56102102A/ja
Publication of JPS56102102A publication Critical patent/JPS56102102A/ja
Publication of JPS6239563B2 publication Critical patent/JPS6239563B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
    • H03D9/00—Demodulation or transference of modulation of modulated electromagnetic waves
    • H03D9/06—Transference of modulation using distributed inductance and capacitance
    • H03D9/0608—Transference of modulation using distributed inductance and capacitance by means of diodes
    • H03D9/0633—Transference of modulation using distributed inductance and capacitance by means of diodes mounted on a stripline circuit
    • H03D9/0641—Transference of modulation using distributed inductance and capacitance by means of diodes mounted on a stripline circuit located in a hollow waveguide

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Waveguide Connection Structure (AREA)
JP518180A 1980-01-18 1980-01-18 Stereo-plane circuit Granted JPS56102102A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP518180A JPS56102102A (en) 1980-01-18 1980-01-18 Stereo-plane circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP518180A JPS56102102A (en) 1980-01-18 1980-01-18 Stereo-plane circuit

Publications (2)

Publication Number Publication Date
JPS56102102A JPS56102102A (en) 1981-08-15
JPS6239563B2 true JPS6239563B2 (en]) 1987-08-24

Family

ID=11604055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP518180A Granted JPS56102102A (en) 1980-01-18 1980-01-18 Stereo-plane circuit

Country Status (1)

Country Link
JP (1) JPS56102102A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03105368U (en]) * 1990-02-14 1991-10-31
US11414440B2 (en) * 2016-11-21 2022-08-16 Lg Chem, Ltd. Modifier, method of preparing the same, and modified conjugated diene-based polymer including the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03105368U (en]) * 1990-02-14 1991-10-31
US11414440B2 (en) * 2016-11-21 2022-08-16 Lg Chem, Ltd. Modifier, method of preparing the same, and modified conjugated diene-based polymer including the same

Also Published As

Publication number Publication date
JPS56102102A (en) 1981-08-15

Similar Documents

Publication Publication Date Title
US5252882A (en) Surface acoustic wave device and its manufacturing method
US5057805A (en) Microwave semiconductor device
KR100721839B1 (ko) 캐리어 기판의 제조 방법 및 반도체 장치의 제조 방법
JP4623850B2 (ja) 高周波半導体素子収納用パッケージおよびその実装構造
KR19990029974A (ko) 결합 유도 코일과 집적 회로 반도체 칩이 구비되는 단일 리드프레임 패키지 및 그 제조방법
US5631809A (en) Semiconductor device for ultrahigh frequency band and semiconductor apparatus including the semiconductor device
JP2002334944A (ja) 中空構造パッケージ
US5028741A (en) High frequency, power semiconductor device
JP2010087469A (ja) 高周波パッケージ装置およびその製造方法
US6359536B1 (en) High frequency multi-layer module with electronic component receiving aperture and conductive via
US5512781A (en) Semiconductor package device for super high-frequency band
US7098531B2 (en) Jumper chip component and mounting structure therefor
JP3227631B2 (ja) アンテナ
JPS6239563B2 (en])
CA2231635C (en) Dual-mode micrometer/millimeter wave integrated circuit package
JP4532018B2 (ja) 小型アンテナ及びその製造方法
US5783847A (en) Dual-mode micrometer/millimeter wave integrated circuit package
JP3916988B2 (ja) 高周波モジュール
CN113206370B (zh) 一种带天线立柱的框架式封装结构及其制备方法
JPS63190405A (ja) 同軸型誘電体共振器の実装方法
JPH0817960A (ja) Ｑｆｐ構造半導体装置
JP2005130406A (ja) 導波管部材および導波管ならびに高周波モジュール
JPS5838612Y2 (ja) 立体平面回路の半導体素子取付装置
JPH05129732A (ja) 半導体レーザ装置
JP2003078342A (ja) チップアンテナとその製造方法